we have the
capabilities to process 100mm, 125mm, 150mm and 200mm wafers.
Etching and Films
Remove epi, oxides, photoresist or any other films you may
need removed.
Lapping
Double sided lapping is available.
Lasermarking
Each wafer can be lasermarked with the same value,
lasermarked in sequential series or in any other patterns.
Polish
Our polish step removes all scratches and pits from wafer
surfaces. This allows multiple reclaims on each wafer, with increased
cost savings.
List of Services
Full Reclaim
EPI Reclaim
Strip & Clean
Double Side Lap
Specialty Processing
Virgin Test Wafers
Applications Engineering
Inventory Management Services |