We have the
capabilities to process 100mm, 125mm, 150mm and 200mm wafers.
Etching and Films
oxides, photoresist or any other films you may need removed.
lapping is available.
can be lasermarked with the same value, lasermarked in sequential series or in
any other patterns.
step removes all scratches and pits from wafer surfaces. This allows multiple
reclaims on each wafer, with increased cost savings.
List of Services
Strip & Clean
Double Side Lap
Virgin Test Wafers
Inventory Management Services