Services

 

We have the capabilities to process 100mm, 125mm, 150mm and 200mm wafers.

Etching and Films

Remove epi, oxides, photoresist or any other films you may need removed.


Lapping

Double sided lapping is available.
 


Lasermarking

Each wafer can be lasermarked with the same value, lasermarked in sequential series or in any other patterns.


Polish

Our polish step removes all scratches and pits from wafer surfaces. This allows multiple reclaims on each wafer, with increased cost savings.


List of Services