Production Expertise
Our staff represents
over 60 years of extensive experience in the semiconductor industry.
SST provides a high yield service which results in lower unit wafer costs.
Our process minimizes the amount of material removed from the wafer surface
which in turn allows our customers to extend the life cycle of a test wafer.
We provide total solutions to your silicon wafer needs by tailoring our
process to each individul customer specification.
The Process
The standard reclaim
process begins with an incoming sort and characterization. If
necessary, films on the wafer are removed through chemical strip, followed
by a lap process, if applicable. A tailored polish step removes a
minimal amount of silicon and leaves the wafer with a flat mirror finish.
Our cleaning process routinely produces wafer with less than 50 particles @
0.16 um for 200mm wafers and less than 30 @ 0.2 um for 150mm wafers.
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